Distinct Molecular Structures of Edge and Middle Positions of Plasma Treated Covered Polymer Film Surfaces Relevant in the Microelectronics Industry
writer：Nathan W. Ulrich, Xu Li, John N. Myers, Jaimal Williamson, Xiaolin Lu, and Zhan Chen
keywords：SFG, Microelectronics, Structure
source：期刊
specific source：IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, VOL. 7, NO. 8, AUGUST 2017
Issue time：2017年
Plasma treatment processing is a ubiquitous and necessary processing step in the manufacturing of electronic components. In the semiconductor industry, this processing step is utilized to clean the polymer substrates prior to soldering and applying epoxy underfill resins in flip-chip technology. In this paper, two polymers, polystyrene and polyimide, were protected with a cover and exposed to various plasmas, to simulate the plasma processing steps found within the microelectronics industry.
http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=7981381