Studies on the Thermal Properties of Epoxy Resins Modified with Two Kinds of Silanes
writer：S.Q. Ma, W.Q. Liu*, Q.Q. Su, Y.F. Liu
keywords：dehydration polycondensation, epoxy resins, silicon, modification, thermal properties, toughness
source：期刊
specific source：Journal of Macromolecular Science Part B: Physics
Issue time：2010年
Dimethyldiethoxysilane (DMDES) and diphenyldimethoxysilane (DPDMS)-containing epoxy resins were synthesized by dehydration polycondensation. The chemical structures were determined by FT-IR, 1H NMR, and 13C NMR. The cured samples, with 4, 4''''-diaminodiphenylmethane (DDM) as curing agent, were investigated by differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), scanning electron microscopy (SEM), and tensile and impact testing. Results showed that DMDES and DPDMS-modified epoxy resins possess higher glass transition temperatures, better thermal stability, and better fracture toughness than the neat epoxy resin.