Mechanical and thermal properties and morphology of epoxy resins modified by a silicon compound
作者：S.Q. Ma, W.Q. Liu*, Z.J. Wei, H.J. Li
關鍵字：Epoxy, silicon, sol-gel, mechanical properties, morphology, thermal property
論文來源：期刊
具體來源：Journal of Macromolecular Science, Part A: Pure and Applied Chemistry
發表時間：2010年
A silicon compound (GAPSO) was synthesized to modify the diglycidyl ether of bisphenol-A (DGEBA). The chemical structure of GAPSO was confirmed using FT-IR, 29Si NMR and GPC. The mechanical and thermal properties and morphologies of the cured epoxy resins were investigated by impact testing, tensile testing, differential scanning calorimetry and environmental scanning electron microscopy. The impact strength and tensile strength were both increased by introducing GAPSO, meanwhile the glass transition temperature (Tg ) was not decreased and the morphologies of the fracture surfaces show that the compatibility of GAPSO with epoxy resin was very good and the toughening follows the pinning and crack tip bifurcation mechanism. The high functional groups in GAPSO can react during the curing process, and chemically participate in the crosslinking network. GAPSO is thus expected to improve the toughness of epoxy resin, meanwhile maintain the glass transition temperature.