Investigating interface adhesion of PLA-coated cellulose paper straws: Degradation, plant growth effects, and life cycle assessment
writer：Yao Xie,Ze Ji,Somia Yassin Hussain Abdalkarim,Haicheng Huang, Khaydar E. Yunusov b , Hou-Yong Yu
keywords：Plastic coating，Paper straw，Composting environments，Plant growth，Life cycle assessment
source：期刊
Issue time：2024年
Although bioplastics and paper straws have been introduced as alternatives to single-use plastic straws, their potential environmental, economic, and social impacts have not been analyzed. This study addresses this gap by designing a polylactic acid layer interface adhesion on cellulose paper-based (PLA-P) composite straws by a dip molding process. This process is simple, efficient, and scalable for massive production. Optimizing key manufacturing parameters, including ice bath ultrasonic, overlapping paper strips (2 strips), winding angle (60°), soaking time (5 min), and drying temperature (50 °C), were systematically evaluated to improve straw quality and manufacturing efficiency. PLA chains were found to deposit onto the cellulose network through intermolecular interactions to form a consistent "sandwich" structure, which can improve adhesion, water resistance, and mechanical properties. Interestingly, PLA-P straws effectively decomposed in soil and compost environments, with a 35–40 % degradation rate within 4 months. Besides, PLA-P straw residues affected seed germination and plant growth, but no significant toxic effects were detected. Further, microplastics were observed in soil and plant tissues (roots, stems, and leaves), and their possible diffusion mechanisms were explored. The results of a comprehensive life cycle assessment (LCA) and cost analysis showed that the process improvements reduced the ecological footprint of PLA-P straws and showed good prospects for commercial application. The study's findings contribute to the understanding of bioplastics and paper straws in effectively reducing environmental impact and fostering sustainable development.