(Industrial & Engineering Chemistry Research) Efficient and Simple Fabrication of High-Strength and High-Conductivity Metallization Patterns on Flexible Polymer Films
writer：Jihai Zhang, Yi Xie, Haoran Xu, Tao Zhou*
keywords：polyimide, near-infrared laser, selective metallization, wireless charging
source：期刊
specific source：Industrial & Engineering Chemistry Research, 2022, 61, 6987–6996
Issue time：2022年
Conductive metal circuits, as a cornerstone of flexible electronics are increasingly becoming an important integral part of modern industry. Herein, the metallized patterns and circuits with high strength and high conductivity were fabricated using efficient and simple laser technology. The laser activated polyimide film by 1064 nm near-infrared (NIR) laser was metallized by the electroless copper plating (ECP) process. Moreover, on the basis of the ECP process, the electroless nickel plating (ENP) reaction and electroless gold plating (EGP) reaction are further carried out. The adhesion performance of the obtained copper layer on PI film could reach ASTM D3359-17 4B-5B level. In addition, the thickness of prepared copper circuits on PI film was around 4.8 μm, the corresponding resistivity was calculated at 3.6±0.2 μΩ·cm. Based on this laser induced selective metallization (LISM) technology, the flexible electronic of electric heaters, ultraviolet light-responsive devices, wireless charging, and integration of micro-supercapacitors (MSCs) were also explored. Therefore, this LISM technology exhibits great potential in the large-scale manufacturing of flexible electronics.